Dow Electronic Materials offers a range of electrolytic copper plating products designed for plating of passive devices
COPPER GLEAM™ PCM Plus Copper
Description: A Bright electrolytic copper plating product designed for barrel and rack plating. A single additive is required, which provides for an easy-to-control, economical operation.
Description: Non-cyanide alkaline electrolytic copper plating product that is east to maintain and provides bright and ductile deposits. It is particularly suitable as an under layer for nickel, acid copper, or other finishes.
Copyright © 2018 DuPont and Dow. All rights reserved. The DuPont
Oval Logo and DuPont™ are trademarks of E. I. du Pont de Nemours and
Company or its affiliates. The Dow Diamond Logo, Dow™ is the
trademark of the Dow Chemical Company or its affiliates