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COPPER GLEAM™ CUPULSE PLUS

COPPER GLEAM™ CUPULSE PLUS

Solutions
  • Multi Layered Boards
 
 
 

Features & benefits

  • Compatible with soluble and insoluble anodes
  • Excellent stability & process consistency
  • Excellent surface distribution
  • Exceptional high throw on thick panels
  • Improved PTH leveling
  • Long bath life
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    Product Details

    Fabric/material

    ELECTROLYTIC PLATING

    Design

    COPPER GLEAM CUPULSE A

    Seam

    COPPER GLEAM CUPULSE ADD A

    Packaging

    HDOW CIRCUIT TECHNOLOGIES

    Hazard

    Coated Material

    PRINTED CIRCUIT BOARDS

    Features

    ELECTROLYTIC PLATING
     
     
     
    Technical Resources
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      Safety Data Sheets(All Languages)
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