Flexible Circuits

Copper Gleam™ HGX Electrolytic Copper Plate

Copper Gleam™ HGX Copper is a new product specially formulated for Flexible Printed Circuit Boards (FPC). It produces uniform crystal grain structure to provide a smooth plated surface on rolled copper. The 3 component additive system also allows complete control by CVS analytical method.

Key Benefits:

  • Excellent bright appearance on rolled copper
  • Low internal stress
  • Excellent thickness distribution
  • Improved thermal shock performance
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Excellent Bright Apppearance on Rolled Copper

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Low Stress

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Excellent Throwing Power