|
|
|
Fabric/material |
ELECTROLYTIC PLATING |
|---|---|
|
Design |
COPPER GLEAM HS-200 A 01 |
|
Seam |
COPPER GLEAM HS-200 A(M) |
|
Packaging |
HDOW CIRCUIT TECHNOLOGIES |
|
Hazard |
|
|
Coated Material |
PRINTED CIRCUIT BOARDS |
|
Features |
ELECTROLYTIC PLATING |