COPPER GLEAM™ HS-200 ELECTROLYTIC COPPER

COPPER GLEAM™ HS-200 ELECTROLYTIC COPPER

Solutions
  • Flexible Circuits
 
 
 

Features & benefits

  • Bright uniform deposits
  • Complete analytical control
  • Exceptional physical properties
  • High Throwing power at accelerate plating rate
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    Product Details

    Fabric/material

    ELECTROLYTIC PLATING

    Design

    COPPER GLEAM HS-200 A 01

    Seam

    COPPER GLEAM HS-200 A(M)

    Packaging

    HDOW CIRCUIT TECHNOLOGIES

    Hazard

    Coated Material

    PRINTED CIRCUIT BOARDS

    Features

    ELECTROLYTIC PLATING

     
     
     
    Technical Resources
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      Safety Data Sheets(All Languages)
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