Duraposit™ Electroless Nickel & Aurolectroless™ Immersion Gold

 
 
 

Aurolectroless™ SMT-520 Immersion Gold is the latest final finish product from DuPont Electronic Solutions. Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance. The product delivers uniform, fine-grained deposits of pure gold on substrates including electroless nickel and palladium.

ENIG deposits formed in conjunction with DuPont's Duraposit™ SMT 88 Electroless Nickel bath deliver excellent shelf life and solder joint performance.

Key Benefits:

  • Up to 50% lower make-up and running cost
  • Flexible gold thickness control
  • Uniform and low porosity deposits
  • Excellent corrosion resistance
  • Excellent bath life and stability (up to 20 MTO)
duraposit-electroless-nickel
duraposit-electroless-nickel
 
 
 
Tremendous Gold Cost Savings

Tremendous Gold Cost Savings

 
 
 
Free of "Black Pad" Corrosion

Free of "Black Pad" Corrosion