Post-Clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step. DuPont’s Post-Clean treatments are part of our EKC Technology portfolio.
EKC4000™ PCT Post-Clean Treatment
EKC4000™ PCT is a cost effective replacement that outperforms conventional "rinse" chemistries such as IPA and NMP. It quickly and effectively eliminates corrosion on the wafer surface caused by drag-out (carry over) of chemistry from prior wet cleaning. EKC4000™ PCT is compatible with automatic equipment and is formulated to meet ULSI grade specifications for advanced wafer treatment.
Post-Clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.
Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.View Details
Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.View Details
Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.View Details
Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing.View Details
Organic materials specifically formulated to remove positive & negative photoresist from substrate surfacesView Details