EKC Photoresist & Residue Removers

Post-Clean Treatments

 
 
 

Post-Clean Treatments

Post-Clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step. DuPont’s Post-Clean treatments are part of our EKC Technology portfolio.

Post-Clean treatment portfolio:

EKC4000™ PCT Post-Clean Treatment

EKC4000™ PCT is a cost effective replacement that outperforms conventional "rinse" chemistries such as IPA and NMP. It quickly and effectively eliminates corrosion on the wafer surface caused by drag-out (carry over) of chemistry from prior wet cleaning. EKC4000™ PCT is compatible with automatic equipment and is formulated to meet ULSI grade specifications for advanced wafer treatment.

Photoresist & Residue Removers

  • Post-Clean Treatments

    Post-Clean Treatments

    Post-Clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.

  • Post-Etch Residue Removers

    Post-Etch Residue Removers

    Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.

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  • Post-CMP Cleaners

    Post-CMP Cleaners

    Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.

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  • Removers for LED Fabrication

    Removers for LED Fabrication

    Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts

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  • WLP Photoresist Removers & TSV Cleaners

    WLP Photoresist Removers & TSV Cleaners

    Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing

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  • Photoresist Removers

    Photoresist Removers

    Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces

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