EKC® Specialized Removers and Clean Chemistries

Post-Etch Residue Removers

 
 
 

EKC® Post-Etch Residue Removers

DuPont’s post-etch residue removers are aqueous and semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes. Post-etch residue removers are part of our EKC Technology portfolio.

Those products are designed to clean residues created during the etch process, while keeping compatibility with exposed metal and dielectric materials. DuPont has products for Aluminum process integration, and more recently for Copper process integration. 

 

Specialized Removers and Clean Chemistries

  • Post-Etch Residue Removers

    Post-Etch Residue Removers

    Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.

    DuPont’s post-etch residue removers are aqueous and semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces.

    DuPont’s post-etch residue removers for copper (Cu) applications include CuSolve™ copper integration technology and SAC™ semi-aqueous chemistry removers.

  • Post-CMP Cleaners

    Post-CMP Cleaners

    Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.

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  • EKC® Strippers & Rinses

    EKC® Strippers & Rinses

    Strippers to remove photoresist used during the lithography process

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    DuPont offers organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces.

    The production of LED dies can require a variety of wet chemical treatments, and DuPont has put its science to work in formulating solutions for the LED industry.

    DuPont’s photoresist removal and through-silicon via (TSV) cleaning formulations are optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping.