DuPont’s post-etch residue removers are aqueous and semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes. Post-etch residue removers are part of our EKC Technology portfolio.
PlasmaSolv® products are designed to remove post etch residue. These products perform at low operating temperatures, well below the flashpoint of the chemistry, providing a safe chemical process as well as extending bath life.
EKC245™ is specifically designed to clean post-etch residues generated during the volume production of high capacity DRAM devices. It is also used to clean HBr-etched polysilicon and is able to remove residues after metal etch.
EKC265™ was the initial product in the PlasmaSolv® series formulated to remove photoresist residue generated after etch processes. It is effective with or without oxygen ash processing.
EKC270™ is a post-etch residue remover with improved Ti compatibility. It is formulated to remove ashed photoresist residue, organic polymer, and organometallic etch residue while maintaining optimum metal stack integrity.
EKC270™-T is an aqueous/organic mixture designed to remove post-etch or post-ash residues on conventional Al/Cu interconnect designs.
CuSolve™ products are copper compatible cleaning products formulated specifically for advanced designs integrating copper. These products remove photoresist and copper containing residues in the presence of exposed copper and low-k materials.
The SAC™ (semi-aqueous chemistry) series of products comprise the industry’s most effective solution to the cleaning of etch residue at or below critical dimensions of 0.25µm. Used at ambient temperature for short process times, SAC™ products eliminate W plug failures and facilitate advanced interconnect by complete cleaning of both subtractive etch and damascene structures.
EKC652™ is a semi-aqueous formulation that removes post-etch residue quickly and effectively from substrates containing traditional integration materials.
Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.
Post-Clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.View Details
Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.View Details
Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contactsView Details
Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printingView Details
Organic materials specifically formulated to remove positive & negative photoresist from substrate surfacesView Details