Strippers (Photoresist Removers)

DuPont offers organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces through our EKC Technology portfolio.

 

 
 
 

Specialized Removers and Clean Chemistries

  • EKC® Strippers & Rinses

    EKC® Strippers & Rinses

    Strippers to remove photoresist used during the lithography process

    Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces

    Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.

    Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing.
  • Post-Etch Residue Removers

    Post-Etch Residue Removers

    Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.

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    Post-etch residue removers are aqueous and semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.

    DuPont’s post-etch residue removers for copper (Cu) applications include CuSolve™ copper integration technology and SAC™ semi-aqueous chemistry removers.
  • Post-CMP Cleaners

    Post-CMP Cleaners

    Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.

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