High Speed Silver Electroplating Products for IC Leadframes

Dow Electronic Materials offers high purity electrolytic silver jet plating products for the IC leadframe market.

Products

SILVERJET™ 220SE High Speed Silver
Description: A semi-bright to bright silver plating product designed to operate in high-speed jet stream selective electroplating equipment to produce high purity silver electrodeposits suitable for semiconductor applications.

SILVERJET™ 300SD High Speed Silver
Description: A high-speed pure silver product designed for jet plating applications. The deposits are either matte or bright dependent upon requirements and can readily be used on both copper alloy and nickel alloy substrates.

SILVERJET™ 850 High Speed Silver
Description: A matte to semi-bright silver plating product designed to operate in high-speed jet stream selective electroplating equipment to produce high purity silver electrodeposits suitable for semiconductor applications.