Leadframes

Silver Electroplating Solutions

 
 
 

DuPont Electronic Solutions offers high purity electrolytic silver jet plating products for the IC leadframe market.

Products

Silverjet™ 220SE High Speed Silver
Description: A semi-bright to bright silver plating product designed to operate in high-speed jet stream selective electroplating equipment to produce high purity silver electrodeposits suitable for semiconductor applications.

Silverjet™ 300SD High Speed Silver
Description: A high-speed pure silver product designed for jet plating applications. The deposits are either matte or bright dependent upon requirements and can readily be used on both copper alloy and nickel alloy substrates.

Silverjet™ 850 High Speed Silver
Description: A matte to semi-bright silver plating product designed to operate in high-speed jet stream selective electroplating equipment to produce high purity silver electrodeposits suitable for semiconductor applications.

Silveron™ GT-101 Bright Silver
Silveron™ GT-101 Bright Silver is an alkaline non-cyanide pure silver electroplating product designed to produce bright silver deposits for various applications. The product can be used in conventional plating equipment and high-speed reel-to-reel, jet or wire plating equipment. The silver deposits can be applied to both copper and nickel alloy substrates.