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MICROFILL™ THF-100 ELECTROLYTIC COPPER BATH

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MICROFILL™ THF-100 ELECTROLYTIC COPPER BATH

Solutions
  • High Density Interconnect
 
 
 

Features & benefits

  • CVS can be applied for bath control
  • DC Process
  • Elimination of conductive paste, ink and solvents
  • Excellent copper to copper adhesion, providing improved reliability
  • Excellent through hole fill performance
  • Highly conductive, improved thermal properties
  • Reduced CTE mismatch within filled via structure
  • Reduced costs/Increased productivity
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    Product Details

    Fabric/material

    ELECTROLYTIC PLATING

    Design

    MICROFILL THF-100 BRIGHT

    Seam

    XV110055 THF BRIGHTENER

    Packaging

    HDOW CIRCUIT TECHNOLOGIES

    Hazard

    Coated Material

    PRINTED CIRCUIT BOARDS

    Features

    ELECTROLYTIC PLATING
     
     
     
    Technical Resources
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    Safety Data Sheets(All Languages)
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