Dow Electronic Materials offers advanced electrolytic nickel, palladium and gold products that are suitable for pre-plated frames application.
NIKAL™ SC Nickel
Description: NIKAL™ SC Electrolytic Nickel delivers matte to semi-bright ductile nickel deposits which provide an excellent barrier to copper diffusion.
PALLADURE™ 200 Palladium
Description: PALLADURE™ 200 Electrolytic Palladium is a high speed, mildly alkaline product that produces ductile and low porosity deposits that enhance wire bonding and solderability.
AURO STRIKE™ GP-3 (SEA) Gold Strike
Description: AURO STRIKE™ GP-3 (SEA) Gold Strike produces a pure gold deposit that enhances wire bonding and solderability performance over palladium.
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