Novaplane™ Slurries

NOVAPLANE™ SLURRIES

The Novaplane™ slurry platform is a family of tungsten (W) slurries with high removal rates and tunable selectivities that can provide superior topography performance, fulfill defect reduction requirements and offer low cost of ownership to meet customers’ needs in tungsten CMP polishing.

 
 
 

Features & benefits

  • Slurries are designed to enable the planarization and material removal such that surface quality and material property integrity is maintained or improved.
  • Slurries are made up of a combination of key additives which enable precise polishing of the wafer surface. 
  • State-of-the-art polishing slurries enable topography or flatness to be maintained at or less than 300 angstroms across a 300mm wafer.
  • Surface finish of materials, including corrosion sensitive metals, is maintained at the single-digit angstrom level.
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