Palladium and Palladium Alloy Electroplating Products for Connectors

Dow Electronic Materials offers electrolytic palladium and palladium alloy products with functionality, cost efficiency and environmental performance to meet the needs of today’s applications.

Products

PALLADURE™ 200 Palladium
Description: Produces a ductile palladium deposit with low porosity for bonding and solderability.

PALLAMET™ 600 Palladium-Nickel
Description: Produces a bright, ductile palladium-nickel deposit of approximately 80% Pd/20% Ni from a low ammonia sulfate-based (chloride-free) electrolyte, which is completely free of ammonia odor. A stable alloy composition over a wide current density range, provides a cost effective solution for reducing gold thickness.