Pyralux® AP Copper-Clad Laminate

DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.


• Low CTE plated through hole reliability
• Excellent thermal resistance
• Excellent moisture and insulation resistance properties
• Low moisture absorption
• High tear strength
• Excellent dielectric thickness tolerance
• High peel strength
• Low outgassing, NASA data available
• UL 94 V-0 flammability rating
• UL maximum operating temperature (MOT) 180C
• Certified to IPC 4204A/11
• Halogen free
• Available in polyimide thicknesses of 0.5, 1.0, 2.0, 3.0, 4.0, 5.0, and 6.0 mils; 7.0-20 mils available upon special request
• Available in copper thicknesses of 5.0, 9.0, 12, 18, 35, and 70 microns; thicker copper available upon special request
• Available in copper types RA, ED, and DT(RA)
• Custom sizes available in up to 85 inches in length

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