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Pyralux® APR Resistor Laminate

Pyralux® APR Resistor Laminate

DuPont™ Pyralux® APR Resistor Laminate features an adhesiveless, all-polyimide dielectric layer in combination with TCR® Thin-Film Embedded Resistor Copper Foil from Ticer Technologies. This material system is ideal for multilayer flex, rigid-flex, and rigid PCB applications which require reliable embedded resistor technology, advanced material performance, temperature resistance, high reliability, and robust processing. Offered in a wide range of dielectric thicknesses and resistance levels, Pyralux® APR provides designers, fabricators, and assemblers a versatile option for circuit fabrication.

Special Warnings
  • Should be stored in original packaging at temperatures of 4 - 29 °C (40 - 85 °F) and below 70% relative humidity. The product should not be frozen and should be kept dry, clean, and well-protected.
Recommendations
  • Prior to handling, DuPont recommends referencing the Pyralux® Safe Handling Guide available at pyralux.dupont.com.
Solutions
  • All-Polyimide Solutions
 
 
 

Features & benefits

  • Balanced and unbalanced constructions available
  • DuPont™ Pyralux® APR Resistor Laminate is fully compatible with all conventional flexible circuit fabrication processes.
  • Embedded capacitance and resistance in a single laminate
  • Embedded capacitance and resistance in a single laminate
  • Excellent bond strength affords high reliability
  • Excellent resistive and dielectric layer tolerance and electrical performance
  • Excellent thermal resistance
  • High copper polyimide resistor foil adhesion strength
  • High thermal resistance
  • Low coefficient of thermal expansion for flex and rigid multi-layer PCBs
  • Resistor formation requires a 2 or 3 step etch process, depending on the resistor material type. Common etchant chemistries are suitable for use.
  • RoHS Compliant
  • Thin, rugged copper clad laminate with superior handling and processing
  • Tight dielectric thickness tolerance
  • UL 94 VTM-0, UL File E124294
  • World class resistive layer tolerance and electrical performance
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    Physical Properties

    Property Method Unit Value
    Peel Strength (Adhesion to Copper) As Received, After Solder IPC-TM-650 2.4.9 N/mm (lb/in) N/mm (lb/in) 1.4 (8) 1.4 (8)
    Volume Resistivity (prlx-32) IPC-TM-650 2.5.17 Ω ∙cm > 1016
    Moisture Absorption (prlx-23) IPC-TM-650 2.6.2 % 0.8
    Flexural Endurance, cycles IPC-TM-650 2.4.3 — 6000
    Coefficient of Thermal Expansion XY-Axis IPC-TM-650 2.4.41 ppm/°C Below Tg - 25 / Above Tg 30
    Moisture & Insulation Resistance IPC-TM-650 2.6.3.2 Ω > 1017
    Solder Float, 288 °C for 10 s IPC-TM-650 2.4.13 — Pass
    Tensile Strength (prlx-31) IPC-TM-650 2.4.19 MPa 345
    IPC-TM-650 2.4.19 GPa 4.8
    Sheet Resistance IPC-TM-650 2.5.14 Ω/u 25
    Elongation (prlx-15) IPC-TM-650 2.4.19 % 50
    Dielectric Strength (prlx-11) ASTM D149 V/µm 200
    Dimensional Stability (MD/TD) After Etching, After Thermal (200 °C for 30 min) IPC-TM-650 2.2.4 % ± 0.04 to ± 0.08% ± 0.04 to ± 0.07%
    Surface Resistance IPC-TM-650 2.5.17 Ω > 1016
    Glass Transition Temperature (Tg) (prlx-18) DuPont Method, TMA °C 220
     
     
     
     
     
     
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