DuPont™ Pyralux® TA and TAH are Double-sided Copper-clad Laminates featuring adhesive-less, all-polyimide dielectric layers. These materials exhibit excellent low loss performance, enabling remarkable signal integrity in high-speed digital and highfrequency circuit applications. Offered in a variety of both dielectric and conductor thickness, DuPont™ Pyralux® TA and TAH provide designers, fabricators, and assemblers a versatile option for a wide variety of flexible circuit constructions.
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Gross Weight | Net Weight | Carton Each | Carton Length | Carton Weight | Carton Height |
---|---|---|---|---|---|
24000 | 0 | 0 | 0 | ||
73539 | 0 | 0 | 0 |
Property | Value | Unit | Method |
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Tensile Strength (prlx-31) | IPC-TM-650 2.4.19 | Gpa | > 7 |
IPC-TM-650 2.4.19 | MPa | > 350 | |
Coefficient of Thermal Expansion XY-Axis | IPC-TM-650 2.4.41 | ppm/°C | 25 |
Surface Resistance | IPC-TM-650 2.5.17 | Ω | > 1015 |
Dielectric Constant (Dk) | ASTM D2520 | 10 GHz | 3.2 |
Chemical Resistance Tensile Strength Retention, Elongation Retention, Peel Strength Retention | DuPont Method, NaOH & HCl Dip for 10 min separately | % | > 80% > 80% > 90% |
Moisture Absorption (prlx-23) | IPC-TM-650 2.6.2 | % | 0.5 |
Flexural Endurance, cycles | JIS C6471 (MIT) | — | > 200 |
Dimensional Stability (MD/TD) After Etching, After Thermal (200 °C for 30 min) | IPC-TM-650 2.2.4 | % | ± 0.1 % ± 0.1 % |
Peel Strength (Adhesion to Copper) As Received, After Solder | IPC-TM-650 2.4.9 | N/mm (lb/in) N/mm (lb/in) | > 0.9 (> 5.1) > 0.9 (> 5.1) |
Loss Tangent (Df) | ASTM D2520 | 10 GHz | 0.003 |
Volume Resistivity (prlx-32) | IPC-TM-650 2.5.17 | Ω ∙cm | > 1016 |
Solder Float, 288 °C for 10 s | IPC-TM-650 2.4.13 | — | Pass |
Elongation (prlx-15) | IPC-TM-650 2.4.19 | % | 45 |
Glass Transition Temperature (Tg) (prlx-18) | DuPont Method, TMA | °C | 220 |
Fabric/material |
E FILM |
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Design |
100TAB-E |
Seam |
K FILM |
Packaging |
100TAB-E |
Hazard |
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Coated Material |
HPF FLM SF&FP |
Features |
PLAIN FILMS |