English

Pyralux® TA & TAH Copper-Clad Laminate

Pyralux® TA & TAH Copper-Clad Laminate

DuPont™ Pyralux® TA and TAH are Double-sided Copper-clad Laminates featuring adhesive-less, all-polyimide dielectric layers. These materials exhibit excellent low loss performance, enabling remarkable signal integrity in high-speed digital and highfrequency circuit applications. Offered in a variety of both dielectric and conductor thickness, DuPont™ Pyralux® TA and TAH provide designers, fabricators, and assemblers a versatile option for a wide variety of flexible circuit constructions.

Special Warnings
  • Should be stored in original packaging at temperatures of 4 - 29 °C (40 - 85 °F) and below 70% relative humidity. The product should not be frozen and should be kept dry, clean, and well-protected.
Recommendations
  • Prior to handling, DuPont recommends referencing the Pyralux® Safe Handling Guide available at pyralux.dupont.com.
Solutions
  • All-Polyimide Solutions
 
 
 

Features & benefits

  • Compatible with conventional flexible circuit fabrication processes, including oxide treatment and wet chemical plated-through-hole desmearing
  • Excellent static bending repeatability and mechanical performance
  • Excellent thermal resistance from all-polyimide dielectric
  • Fabricated circuits can be cover coated and laminated together to form multilayers or bonded to heat sinks using polyimide, acrylic, or epoxy adhesives.
  • High flex and bending reliability due to excellent adhesion between dielectric and copper foil
  • Low loss dielectric and ED Cu foil (TA) or RA Cu foil (TAH) conductor layers
  • Minimal variance in dielectric thickness for consistent circuitry performance
  • Pyralux® TA can pass 350oC solder floating test (10sec * 3 times), and is compatible with hot bar process
  • RoHS Compliant
  • Same process as processing standard PI based FCCL
  • UL 94 VTM-0, UL File E161336
    		•
     
     
     

    Available Sizes

    Gross Weight Net Weight Carton Each Carton Length Carton Weight Carton Height
    24000 0 0 0
    73539 0 0 0
     
     
     

    Physical Properties

    Property Method Unit Value
    Tensile Strength (prlx-31) IPC-TM-650 2.4.19 Gpa > 7
    IPC-TM-650 2.4.19 MPa > 350
    Coefficient of Thermal Expansion XY-Axis IPC-TM-650 2.4.41 ppm/°C 25
    Surface Resistance IPC-TM-650 2.5.17 Ω > 1015
    Dielectric Constant (Dk) ASTM D2520 10 GHz 3.2
    Chemical Resistance Tensile Strength Retention, Elongation Retention, Peel Strength Retention DuPont Method, NaOH & HCl Dip for 10 min separately % > 80% > 80% > 90%
    Moisture Absorption (prlx-23) IPC-TM-650 2.6.2 % 0.5
    Flexural Endurance, cycles JIS C6471 (MIT) — > 200
    Dimensional Stability (MD/TD) After Etching, After Thermal (200 °C for 30 min) IPC-TM-650 2.2.4 % ± 0.1 % ± 0.1 %
    Peel Strength (Adhesion to Copper) As Received, After Solder IPC-TM-650 2.4.9 N/mm (lb/in) N/mm (lb/in) > 0.9 (> 5.1) > 0.9 (> 5.1)
    Loss Tangent (Df) ASTM D2520 10 GHz 0.003
    Volume Resistivity (prlx-32) IPC-TM-650 2.5.17 Ω ∙cm > 1016
    Solder Float, 288 °C for 10 s IPC-TM-650 2.4.13 — Pass
    Elongation (prlx-15) IPC-TM-650 2.4.19 % 45
    Glass Transition Temperature (Tg) (prlx-18) DuPont Method, TMA °C 220
     
     
     
    Product Details

    Fabric/material

    E FILM

    Design

    100TAB-E

    Seam

    K FILM

    Packaging

    100TAB-E

    Hazard

    Coated Material

    HPF FLM SF&FP

    Features

    PLAIN FILMS
     
     
     
    Technical Resources
    View by:
    ✕
    ✕
    To access secured content from DuPont Please Sign In or Sign Up below
     
     
     
    Safety Data Sheets(All Languages)
    View by:
    ✕
    ✕
    To access secured content from DuPont Please Sign In or Sign Up below
     
     
     
     
     
     
    -