DuPont™ Pyralux® TK is a double-sided copper-clad laminate featuring a proprietary layered dielectric, featuring Kapton® polyimide and fluoropolymer films. This unique composition affords the lowest loss performance for a Pyralux® copper-clad laminate, enabling remarkable signal integrity in high speed digital and high frequency circuit applications. Offered with both rolled annealed (RA) and electrodeposited (ED) copper foil, Pyralux® TK can address your highest performance flex and rigid-flex applications where dielectric constant must fall below 3.0
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| Property | Method | Unit | Value |
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| Moisture Absorption (prlx-23) | IPC-TM-650 2.6.2 | % | 0.6 |
| Peel Strength (Adhesion to Copper) As Received, After Solder | IPC-TM-650 2.4.9 | N/mm (lb/in) N/mm (lb/in) N/mm (lb/in) | 1.2 (7.0) 1.2 (7.0) 0.2 (7.0) |
| Flexural Endurance, cycles | JIS C6471 (MIT) | — | > 700 |
| Coefficient of Thermal Expansion XY-Axis | IPC-TM-650 2.4.41 | ppm/°C | 27 |
| Tensile Strength (prlx-31) | IPC-TM-650 2.4.19 | GPa | > 3.2 |
| IPC-TM-650 2.4.19 | MPa | > 175 | |
| Elongation (prlx-15) | IPC-TM-650 2.4.19 | % | 60 |
| Decomposition Temperature (2% / 5%) | DuPont Method, TMA | °C | 531 / 548 |
| Dielectric Strength (prlx-11) | ASTM D149 | V/µm | 200 |
| Solder Float, 288 °C for 10 s | IPC-TM-650 2.4.13 | — | Pass |
| Loss Tangent (Df) | ASTM D2520 | 10 GHz | 0.002 |
| Dimensional Stability (MD/TD) After Etching, After Thermal (150 °C for 30 min) | IPC-TM-650 2.2.4 | % | ± 0.05 / 0.07 % ± 0.07 / 0.13 % |
| Dielectric Constant (Dk) | ASTM D2520 IPC-TM-650 2.5.5.5 | 10 GHz 10 GHz | 2.5 2.8 |
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Fabric/material |
TK CLAD |
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Design |
TK1810018R |
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Seam |
TK CLADS |
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Packaging |
TK1810018R |
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Hazard |
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Coated Material |
TK CLAD |
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Features |
SHEET CLADS |