Dry Film Photoresist

Riston® DI6100M Dry Film Photoresist

 
 
 

Riston® DI6100M Dry Film Photoresist

Fine line direct imaging photoresist solution for HDI mSAP application

Advantages:

  • Excellent fine line adhesion and resolution for mSAP pitch 40µm design 
  • Superior conformation offering solutions to improve short related defect for high yield productivity 
  • Fast photo speed for high exposure process throughput
    (i-line and h-line multiple wavelength DI equipment) 
 
 
 

6µm adhesion x/x=1/3 

6µm resolution x/x=1/1 

Substrate: ED Cu, Ra=0.28µm
Exposure tool: IP-8 (offset=-3)
Exposure tablet: 15SST(IP-8)

Applications:

  • Advanced dry film photoresist for HDI/SLP (Substrate-like PCB) process