Riston® DI6100M Dry Film Photoresist
Fine line direct imaging photoresist solution for HDI mSAP application
Advantages:
- Excellent fine line adhesion and resolution for mSAP pitch 40µm design
- Superior conformation offering solutions to improve short related defect for high yield productivity
- Fast photo speed for high exposure process throughput
(i-line and h-line multiple wavelength DI equipment)
6µm adhesion x/x=1/3
6µm resolution x/x=1/1
Substrate: ED Cu, Ra=0.28µm
Exposure tool: IP-8 (offset=-3)
Exposure tablet: 15SST(IP-8)
Applications:
- Advanced dry film photoresist for HDI/SLP (Substrate-like PCB) process
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