Dry Film Photoresist

Riston® DI9000 Series & DI8600 Dry Film Photoresist

The advanced fine line direct imaging photoresist solution for IC substrate application

 
 
 

Riston® DI9000 Series & DI8600 Dry Film Photoresist

The advanced dry film photoresist for fine line HDI 

Riston® DI9000 Series & DI8600 series are multi-wavelength DI dry film photoresist designed for pitch >= 70µm tent/etch process. It enables fine patterning with excellent yield.

Riston® dry film roadmap (HDI application)

Advantages (*DI9500M):

  • Fine line resolution and adhesion (15µm/15µm)
  • Excellent dimension stability to reach better line width Cpk
  • Excellent conformation for applying thin film to reach better yield and etching factor 
  • Low developing sludge and foaming for easy maintenance
 
 
 
 
 
 
 
 
 

Applications:

  • The advanced dry film solution for HDI (inner layer to outer layer) tent/etch process