Silveron™ GT-820

Siveron™ GT-820 Silver-Tin

Silveron™ GT-820 Silver Tin is an acidic non-cyanide silver-tin electroplating process designed to produce an 80:20 tin-silver alloy. This deposit is ideal for press-fit connector applications due to the low coefficient of friction, low insertion force and high retention force. The product can be used in conventional plating equipment at low or high-speed operations.

• Cyanide-free electrolyte
• Replacement for Tin for whisker free press-fit connectors
• Chemically stable solution without metallic additives
• White, bright silver deposit over a broad CD range (0.5 - 10 ASD)
• Cathode efficiency ca. 100 %
• Excellent adhesion over copper or copper alloys
• Plating over nickel requires a strike layer
• Deposit composition: ca. 80% silver
• Suitable for electrical/electronic applications
• Excellent contact resistance and solderability