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SOLDERON™ BP 1000 Indium Chemistry

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SOLDERON™ BP 1000 Indium Chemistry

Solderon™ BP IN 1000 indium plating chemistry is designed for solder plating processes used in advanced wafer-level packaging for emerging applications that are sensitive to temperature. Its use minimizes substrate warpage and stress, and reduces the possibility of damaging materials in delicate devices due to significantly reduced reflow temperature.

Applications
  • 3D Si die/wafer stacking
  • Compound semiconductors (III-V materials)
  • Flexible and/or coreless substrate assembly
  • Optoelectronics bonding/assembly (multi-sensing CMOS image sensor, display)
  • Production-proven Electroplating Chemistries for Wafer Level Packaging
  • Temperature-sensitive biosensors
Solutions
  • Solder Bump Plating
 
 
 

Features & benefits

  • A variety of formulations including tin-silver alloys, pure tin, and indium materials meet a range of process temperatures and melting points
  • A wide process window
  • Excellent thickness uniformity
  • Good surface morphology
  • High-speed plating capabilities
  • Our lead-free, single-step plating materials are specifically designed for the most challenging advanced wafer-level packaging applications
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    Designed for Lead-free Bumping, Capping
  • In wafer level packaging processes, bumps range in size and shape from standard C4 bumps, to solder caps on Cu pillars and µpillars.
  • Solder bumps form the electronic interconnect between a chip and its substrate.
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    Versatility 
  • Additionally, its low melting temperature also makes it a good option for bonding multiple thin layers.
  • It has demonstrated good within-die co-planarity in test vehicles during bumping and capping applications.
  • It is compatible with mainstream bumping photoresist materials, and can be integrated directly into existing process flows.
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    Performance
  • Finally, Solderon™ BP IN 1000 Indium delivers stable and consistent performance over thermal and electrolytic aging
  • Solderon™ BP IN 1000 Indium achieves low-temperature reflow, with peak temperatures around 180°C (depending on profile optimization).
  • The material demonstrates macro and micro void-free performance even after multiple reflows to form reliable interconnections across various under-bump metallization materials
  • This is 80°C lower than typical SnAg reflow temperatures.
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    Product Details

    Fabric/material

    AP SOLDER

    Design

    SO BP IN 1000 RTU

    Seam

    SOLDERON™BP IN 1000 RTU

    Packaging

    AP SOLDER

    Hazard

    Coated Material

    AP SOLDER

    Features

    AP SOLDER
     
     
     
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