SOLDERON™ BP SN 6000 PRIMARY

SOLDERON™ BP SN 6000

SOLDERON BP PRIMARY / 1 GA COR PDB

Applications

Production-proven Electroplating Chemistries for Wafer Level Packaging

Solutions

Solder Bump Plating

Features & benefits

	A variety of formulations including tin-silver alloys, pure tin, and indium materials meet a range of process temperatures and melting points A wide process window Excellent thickness uniformity Good surface morphology High-speed plating capabilities Our lead-free, single-step plating materials are specifically designed for the most challenging advanced wafer-level packaging applications
Designed for Lead-free Bumping, Capping	In wafer level packaging processes, bumps range in size and shape from standard C4 bumps, to solder caps on Cu pillars and µpillars. Solder bumps form the electronic interconnect between a chip and its substrate.

Available Sizes

Gross Weight	Net Weight	Carton Each	Carton Length	Carton Weight	Carton Height
		10	0	0	0
		757	0	0	0

Product Details

Fabric/material	AP SOLDER
Design	SO BP SN 6000 PRIMARY
Seam	SO BP TS 6000 PRIMARY
Packaging	AP SOLDER
Hazard
Coated Material	AP SOLDER
Features	AP SOLDER

Technical Resources

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Safety Data Sheets(All Languages)

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