SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry

SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry

SOLDERON BP PRIMARY / 1 GA COR PDB

Applications
  • Production-proven Electroplating Chemistries for Wafer Level Packaging
Solutions
  • Solder Bump Plating
 
 
 

Features & benefits

  • A variety of formulations including tin-silver alloys, pure tin, and indium materials meet a range of process temperatures and melting points
  • A wide process window
  • Excellent thickness uniformity
  • Good surface morphology
  • High-speed plating capabilities
  • Our lead-free, single-step plating materials are specifically designed for the most challenging advanced wafer-level packaging applications
  • Designed for Lead-free Bumping, Capping
  • In wafer level packaging processes, bumps range in size and shape from standard C4 bumps, to solder caps on Cu pillars and µpillars.
  • Solder bumps form the electronic interconnect between a chip and its substrate.
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    Available Sizes

    Gross Weight Net Weight Carton Each Carton Length Carton Weight Carton Height
    10 0 0 0
    757 0 0 0
     
     
     
     
     
     
    Product Details

    Fabric/material

    AP SOLDER

    Design

    SO BP SN 6000 PRIMARY

    Seam

    SO BP TS 6000 PRIMARY

    Packaging

    AP SOLDER

    Hazard

    Coated Material

    AP SOLDER

    Features

    AP SOLDER

     
     
     
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    Safety Data Sheets(All Languages)
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