Dow Electronic Materials offers advanced surface treatment material to reduce silver immersion, minimize epoxy bleed, and to inhibit tin whisker growth.
SILVERJET™ Pre-Dip AG201 Silver Anti-Immersion
Description: A sophisticated product provides protection against silver immersion onto copper and copper alloy surface.
SILVERJET™ Post-Dip 90 Silver Anti-EBO
Description: A self adhering product that minimizes epoxy bleed problem associated with silver epoxy and die attach on spot plated silver deposits.
CUPROTEC™ II Copper Anti-Tarnish
Description: CUPROTEC™ II Copper Anti-Tarnish provides a temporary protective film on copper and copper substrates.
SOLDERGUARD™ 100 Post-treatment
Description: SOLDERGUARD™ 100 Post Treatment provides a temporary protective film on tin and tin-alloy surface for whisker minimization under HTH.