The Visionpad™ 3000 series of polishing pads is designed to achieve the defect levels of the Politex™ pad with the pad planarization capabilities of the IC1000™ pad in Copper barrier processes. The Visionpad™ 3000 series has a softer surface than an IC1000™ pad to reduce defects, while maintaining a high stiffness to provide superior planarization.

Benefits:

• Improved defectivity compared to IC1000™
• Improved planarization compared to soft pads

Applications:

• Copper barrier

The Visionpad™ 5000 series is designed for use in Oxide and Tungsten applications. Visionpad™ 5000 series pads exhibit predictable pad-to-pad performance, offer stable operation throughout the process, and demonstrate a similar or increased pad life when compared to IC1000™ pads.

Benefits:

• Improved planarization compared to IC1000™
• Longer pad lifetime due to low cut rate

Uses:

• Tungsten, STI/Ceria, Oxide

The Visionpad™ 6000 series of polishing pads is designed to significantly improve defectivity and dishing performance as well as extend the pad lifetime compared to IC1000™.

Benefits:

• Step-out defectivity performance
• Long pad lifetime due to low cut rate

Applications:

• Copper bulk, STI/Ceria, Oxide

The Visionpad™ 7000 series of polishing pads is designed to significantly improve lifetime compared to IC1000™.

Benefits:

• Long pad lifetime due to low cut rate

Applications:

• Copper Bulk, STI/Ceria, Oxide, Tungsten

The Visionpad™ 9000 series of polishing pads is designed to reduce defectivity and dishing as well as extend the pad lifetime compared to IC1000™.

Benefits:

• Reduced defectivity performance
• Improved dishing performance
• Long pad lifetime due to low cut rate

Applications:

• Copper Bulk, STI/Ceria, Oxide