Visionpad™ Polishing Pads

The Visionpad™ pad series for chemical mechanical planarization (CMP) is a platform designed for multiple applications and advanced nodes. Visionpad™ technology is engineered with unique polymer chemistry, including optimized pore size and porosity levels. This leads to a range of polishing performance options depending on process requirements.

  • The Visionpad™ 3000 series of polishing pads is designed to achieve the defect levels of the Politex™ pad with the pad planarization capabilities of the IC1000™ pad in copper barrier processes. The Visionpad™ 3000 series has a softer surface than an IC1000™ pad for improved defectivity performance, while maintaining a high stiffness to provide superior planarization.

    Benefits:

    • Improved defectivity compared to IC1000™
    • Improved planarization compared to soft pads

    Applications:

    • Copper barrier
  • The Visionpad™ 5000 series is designed for use in oxide and tungsten applications. Visionpad™ 5000 series pads exhibit predictable pad-to-pad performance, offer stable operation throughout the process, and demonstrate a similar or increased pad life when compared to IC1000™ pads.

    Benefits:

    • Improved planarization compared to IC1000™
    • Longer pad lifetime due to low cut rate

    Uses:

    • Tungsten, STI/ceria, oxide
  • The Visionpad™ 6000 series of polishing pads is designed to significantly improve defectivity and dishing performance as well as extend the pad lifetime compared to IC1000™.

    Benefits:

    • Step-out defectivity performance
    • Long pad lifetime due to low cut rate

    Applications:

    • Copper bulk, STI/ceria, oxide
  • The Visionpad™ 7000 series of polishing pads is designed to significantly improve lifetime compared to IC1000™.

    Benefits:

    • Long pad lifetime due to low cut rate

    Applications:

    • Copper bulk, STI/ceria, oxide, tungsten
  • The Visionpad™ 9000 series of polishing pads is designed to reduce defectivity and dishing as well as extend the pad lifetime compared to IC1000™.

    Benefits:

    • Improved defectivity performance
    • Improved dishing performance
    • Long pad lifetime due to low cut rate

    Applications:

    • Copper bulk, STI/ceria, oxide
 
 
 
Other CMP Applications

Our CMP pads cover a wide range of applications and technology nodes. To further explore DuPont CMP pads, see our overview of product families by application.