Twitter
LinkedIn
Email
EKC® Specialized Removers and Clean Chemistries
Post-Etch Residue Removal and Post-CMP Removal Chemistries for Semiconductor Fabrication
DuPont is a leading manufacturer of specialty chemicals used in the removal of photoresist post-dry etch process residue and chemical mechanical polishing (CMP) defectivity.
Our EKC® advanced clean chemistries provide best-in-class process solutions for wafer cleaning, surface preparations, liquid and dry film resist removal, post-CMP cleaning, selective etching and post-etch residue removal (PERR). DuPont's specialized formulations can help allow you to achieve higher productivity and improved yields on designs with finer line width and spacing.
Specialized Removers and Clean Chemistries
-
Post-Etch Residue Removers
Post-Etch Residue Removers
Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.
View DetailsPost-etch residue removers are aqueous and semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.DuPont’s post-etch residue removers for copper (Cu) applications include CuSolve™ copper integration technology and SAC™ semi-aqueous chemistry removers. -
Post-CMP Cleaners
Post-CMP Cleaners
Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.
View Details -
EKC® Strippers & Rinses
EKC® Strippers & Rinses
Strippers to remove photoresist used during the lithography process
View DetailsOrganic materials specifically formulated to remove positive & negative photoresist from substrate surfacesEnable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing.