Specialized Removers and Clean Chemistries
Post-Etch Residue Removal and Post-CMP Removal Chemistries for Semiconductor Fabrication
DuPont is a leading manufacturer of specialty chemicals used in the removal of photoresist post-dry etch process residue and chemical mechanical polishing (CMP) defectivity.
Our advanced clean chemistries provide best-in-class process solutions for wafer cleaning, surface preparations, liquid and dry film resist removal, post-CMP cleaning, selective etching and post-etch residue removal (PERR). DuPont's specialized formulations can help you achieve higher productivity and improved yields on designs with finer line width and spacing.
Specialized Removers and Clean Chemistries
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Post-Etch Residue Removers
Post-Etch Residue Removers
Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.
Post-etch residue removers are aqueous and semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.DuPont’s post-etch residue removers for copper (Cu) applications include CuSolve™ copper integration technology and SAC™ semi-aqueous chemistry removers. -
Post-CMP Cleaners
Post-CMP Cleaners
Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.
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Removers & Rinses
Removers & Rinses
Removers to remove photoresist used during the lithography process
Organic materials specifically formulated to remove positive & negative photoresist from substrate surfacesEnable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing.
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