DuPont offers customers many choices of metal finishes for leadframes depending on the demands of each application, including alloys tailored to customer requirements. We provide a total manufacturing solution as a service to customers developing new leadframe package types. Our portfolio of products includes:
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Metal leadframes appear inside a variety of IC package types, including a quad flat package (QFP) and quad flat no-leads package (QFN). Light-emitting diodes (LEDs) are also built in leadframe packages. Leadframes require a variety of finishes depending on the package design and end application.
Two applications are driving demand for high-performing IC leadframes. The automotive electronics industry is exploding, with an ever-increasing number of components per vehicle. High-end consumer electronics continue to push the envelope on package dimensions.
A higher level of device integration is driving the development of unique package designs and a trend toward packages with a higher number of I/O, finer pitch, and smaller footprint. As package size shrinks, leadframes become more critical for component reliability, requiring more complex surface treatments.
The silver-plated surface of LED leadframes requires a high-quality electrolytic finish to achieve the reliable wire bonding, sufficient brightness, and high reflectivity. This is especially important for high-output LEDs in residential, commercial, and street lighting and automobile headlights.
Tailored metal plating solutions to enhance leadframe performance and component reliability.
A family of pre-and-post treatment products that enhance the performance of IC leadframes parts
High purity electrolytic silver jet plating products for the IC leadframe market
A complete family of electrolytic tin products that enhance functionality with reduced cost of ownership
Advanced electrolytic nickel, palladium and gold products for pre-plated frames application
A high brightness silver electrolytic finish for leadframes that enable high performance LED packages
Enabling high-throughput for maximum cost benefit while delivering exceptional performance
Advanced surface treatment material that reduce silver immersion, minimize epoxy bleed, and inhibit tin whisker growth
Expert Metal Finish Solutions for ConnectorsView Details
Pre-and-post treatment products that enhance the performance of Connectors parts
A complete family of electrolytic tin technologies to enhance reliable interconnections for connector parts
Innovative technologies that enable higher productivity, better functionality and stronger sustainable developments
Advanced Indium electroplating technologies that enhance the reliability of interconnections for connector parts
Electrolytic nickel plating products for the Connector market that enhance corrosion resistance and inhibit tin whisker growth
Electrolytic palladium and palladium alloy products with functionality, cost efficiency and environmental performance
Innovative cyanide-free electrolytic silver products that reduce or replace gold plating
A high-speed, sulphonate-based tin electroplating product that provides bright deposits over a wide current density range
Ensuring Reliable Connections for All Passive DevicesView Details
A range of electrolytic copper plating products designed for plating of passive devices
Advanced electrolytic nickel plating products for Passive Devices that enhance corrosion resistance
Leading electrolytic tin products that meet the needs of passive devices