Electronic Components


Leadframe Finishes

Tailored Solutions for IC and LED Leadframe Finishes

DuPont offers customers many choices of metal finishes for leadframes depending on the demands of each application, including alloys tailored to customer requirements. We provide a total manufacturing solution as a service to customers developing new leadframe package types. Our portfolio of products includes:

  • Plating with many different metals to suit all types of leadframe packages
  • Materials compatible with various types of plating equipment
  • Surface treatments to enhance performance of metal finishes

Choose DuPont as your materials solutions partner to:

  • Improve leadframe package reliability
  • Enable cutting-edge custom package designs
  • Meet requirements for every end use case
  • Metal leadframes appear inside a variety of IC package types, including a quad flat package (QFP) and quad flat no-leads package (QFN). Light-emitting diodes (LEDs) are also built in leadframe packages. Leadframes require a variety of finishes depending on the package design and end application.

  • Two applications are driving demand for high-performing IC leadframes. The automotive electronics industry is exploding, with an ever-increasing number of components per vehicle. High-end consumer electronics continue to push the envelope on package dimensions.

    A higher level of device integration is driving the development of unique package designs and a trend toward packages with a higher number of I/O, finer pitch, and smaller footprint. As package size shrinks, leadframes become more critical for component reliability, requiring more complex surface treatments.

    The silver-plated surface of LED leadframes requires a high-quality electrolytic finish to achieve the reliable wire bonding, sufficient brightness, and high reflectivity. This is especially important for high-output LEDs in residential, commercial, and street lighting and automobile headlights.

Electronic Components

  • Leadframes
  • Connectors
  • Passive Devices
  • Tape Automated Bonding


Tailored metal plating solutions to enhance leadframe performance and component reliability.

Ancillaries for IC Leadframes

A family of pre-and-post treatment products that enhance the performance of IC leadframes parts

High Speed Silver Electroplating Products for IC Leadframes

High purity electrolytic silver jet plating products for the IC leadframe market

Matte Tin Electroplating Products for IC Leadframes

A complete family of electrolytic tin products that enhance functionality with reduced cost of ownership

Nickel, Palladium, and Gold Electroplating Products for IC Leadframes

Advanced electrolytic nickel, palladium and gold products for pre-plated frames application

Silverjet™ High Brightness Silver

A high brightness silver electrolytic finish for leadframes that enable high performance LED packages

Solderon™ ST-300T Matte Tin

Enabling high-throughput for maximum cost benefit while delivering exceptional performance

Surface Treatment for IC Leadframes

Advanced surface treatment material that reduce silver immersion, minimize epoxy bleed, and inhibit tin whisker growth


Expert Metal Finish Solutions for Connectors

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Ancillaries for Connectors

Pre-and-post treatment products that enhance the performance of Connectors parts

Bright and Matte Tin Electroplating Products for Connectors

A complete family of electrolytic tin technologies to enhance reliable interconnections for connector parts

Gold and Gold Alloy Electroplating Products for Connectors

 Innovative technologies that enable higher productivity, better functionality and stronger sustainable developments

Indiplate™ Indium

Advanced Indium electroplating technologies that enhance the reliability of interconnections for connector parts

Nickel and Nickel Alloy Electroplating Products

Electrolytic nickel plating products for the Connector market that enhance corrosion resistance and inhibit tin whisker growth

Palladium and Palladium Alloy Electroplating Products

Electrolytic palladium and palladium alloy products with functionality, cost efficiency and environmental performance

Silver and Silver Alloy Electroplating Products for Connectors

Innovative cyanide-free electrolytic silver products that reduce or replace gold plating

Solderon™ BHT-350 Bright Tin for Connectors

A high-speed, sulphonate-based tin electroplating product that provides bright deposits over a wide current density range

Passive Devices

Ensuring Reliable Connections for All Passive Devices

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Copper Electroplating Products for Passive Devices

A range of electrolytic copper plating products designed for plating of passive devices

Nickel Electroplating Products for Passive Devices

Advanced electrolytic nickel plating products for Passive Devices that enhance corrosion resistance

Tin and Tin-Alloy Electroplating Products for Passive Devices

Leading electrolytic tin products that meet the needs of passive devices

Tape Automated Bonding

Immersion tin for TAB and COF manufacturing.

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Ancillaries for TAB/COF

Supporting products for pre-and-post treatment to enhance the performance of the TAB/COF products

Immersion Tin Products for TAB/COF

Immersion tin products providing exceptional performance with low running cost