Lithography Materials and Services


Lithography Materials and Services

Market-leading Microlithography Materials to Support Advanced Patterning

DuPont designs microlithography materials to improve existing microlithography processes as well as support advanced patterning processes. Our long history in lithography technology includes many industry-first enabling technology innovations. We lead the market in terms of our breadth of offerings, including ArF photoresists, KrF photoresists, i/g line photoresists, extreme ultraviolet (EUV) resists, EUV underlayers, and organic bottom anti-reflective coating (BARC) materials.

By collaborating with you to understand your technical challenges, we develop materials solutions to meet them. The more advanced the process, the more critical it is to work in partnership to design specific materials.

DuPont is here to support you with your biggest (and smallest) lithography challenges! 

  • Microlithography, or photolithography, is an imaging technology that is critical to etch steps in semiconductor manufacturing. It is used to transfer circuitry patterns from a photomask to a silicon wafer, after which etch processes complete the pattern

  • Driven by ubiquitous high-performance, low-power computing needs, the semiconductor manufacturing industry continues to shrink feature sizes to make faster and smaller transistors with higher storage acapacity. This requires high-quality and high-performing lithography materials.


Lithography Materials and Services

  • Photoresists

    DuPont’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.

  • Advanced Overcoats

    Used in conjunction with photoresists, DuPont’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.

  • Anti-Reflectants & Functional Sublayers

    Anti-reflective coatings and sublayers boost the effectiveness of lithography by widening and improving the process and reflectivity windows.

    AR™ 10L is an organic, thermally cross-linking bottom anti-reflectant coating (BARC) for 248 nm (KrF) photoresists. It is designed to provide a universal anti-reflective surface for high- and low-temperature resist platforms and offers excellent compatibility with most ESCAP HYBRID and Acetal resists.

    AR™ 137 is an organic bottom anti-reflectant coating (oBARC) for immersion lithography. It is designed to provide excellent optical parameters to minimize reflection through angles for hyper numerical aperture (NA) immersion exposure.

    An organic gap filling material for extremely narrow trenches

    A family of cross-linkable BARCs that can etch 30% faster than photoresists

    AR™ 254 is an organic, thermally cross-linking bottom anti-reflectant for 248 nm (KrF) photoresist. It has excellent gap filling and planarizing properties that are key requirements for advanced semiconductor devices having FinFET structures. AR™ 254 has a high etch rate to reduce substrate damage and optimal optical parameters to minimize reflectance.
  • Ancillary Lithography Materials

    DuPont’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.

  • Electronic Grade Polymers | DuPont Electronic Solutions

    DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation.

  • Metrology & Imaging Services

    We offer services such as defect testing or patterning wafers


We’re here to help.

We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.