DuPont offers customers complete process solutions for IC leadframe package components. Our portfolio of products includes:
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An etched or stamped metal frame (LEADFRAME) to support the die/chip and allow interconnection by wire bonding the chip to the leadframe. Encapsulation by epoxy resin creates the IC package.
New electronic architecture in vehicles brings increased reliability requirements for electronic components. For IC Packages that means improved adhesion between the leadframe and any metal deposits and the EMC, as well as a holistic, total process approach to package reliability. DuPont offers full process solutions for both leadframe and IC Package treatment.