Dry Film Photoresists - WLP Series


High Performance and High Resolution Multi-Purpose Dry Film Photoresist

WLP 1000 Series dry film photoresists are high resolution, multi-purpose films compatible with copper pillar plating and solder bump plating, both lead-free and eutectic. These films are available in 50, 75, 100 and 120 micron thicknesses.


  • High resolution for fine pitch electro plating process
  • High chemical resistance for silver plating, ENIG and ENEPIG
  • No damage for active metal even through RIE process 
  • Na2CO3 and TMAH developable
  • Fast and totally dissolved stripping mode


  • Capability for finer pitch work than alternative products
  • Improved plating performance
  • Higher development productivity when using TMAH
  • Cleaner stripping

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