The IC1000™ series of pads for chemical mechanical planarization (CMP) is the industry standard. DuPont’s IC1000™ pads are used in a wide variety of CMP applications today. While the IC1000™ formulation has remained constant, the quality and consistency of the product offerings have been improved continuously for over 20 years. Popular pads in this family include the IC1000™ CMP pad and the IC1010™ CMP pad.
Copper bulk, tungsten, STI/Ceria, oxide, buff
Our CMP pads cover a wide range of applications and technology nodes. To further explore DuPont CMP pads, see our overview of product families by application.