The Ikonic™ pad series for chemical mechanical planarization (CMP) is a breakthrough pad platform designed for multiple applications and advanced nodes. DuPont’s latest CMP polishing pad technology combines a range of pad hardness and varying levels of porosity with a pad surface that is easy to condition. The Ikonic™ pad platform is designed to improve wafer defectivity performance and improve removal rate, topography and cost of ownership.
The Ikonic™ 9000 series of polishing pads targets processes that require higher hardness pads. It designed to deliver an excellent compromise between improving defectivity performance and maintaining or increasing removal rate at the most advanced logic and memory technology nodes.
Benefits:
Applications:
Interlayer dielectric (ILD), copper bulk, tungsten
The Ikonic™ 4300 series of polishing pad targets processes that require higher hardness pads. It is designed for processes that require higher planarization and improved defectivity performance.
Benefits:
Applications:
STI/ceria, oxide
The Ikonic™ 4200 series of polishing pad targets processes that require higher hardness pads. It is designed for higher removal rate, which can help reduce cost of ownership for customers by giving higher throughput and/or reducing slurry consumption volume.
Benefits:
Applications:
STI/ceria, tungsten, copper bulk
The Ikonic™ 4100 series of polishing pad targets processes that require higher hardness pads. It is designed to deliver significantly improve defectivity performance in the most advanced Logic and Memory technology nodes.
Benefits:
Applications:
Shallow trench isolation (STI)/ceria, interlayer dielectric (ILD), copper bulk, tungsten
The Ikonic™ 3000 series of polishing pads targets processes that require medium hardness pads. It is designed to deliver step-out improvements in wafer defectivity performance and improved topography performance when compared to IC1000™ pads.
Benefits:
Applications:
Copper bulk
The Ikonic™ 2000 series of polishing pads targets processes that require lower hardness pads. It is designed to deliver step-out improvements in wafer defectivity performance, consistent and stable removal rates, and longer pad lifetime.
Benefits:
Applications:
Copper barrier, buff
Our CMP pads cover a wide range of applications and technology nodes. To further explore DuPont CMP pads, see our overview of product families by application.