The Ikonic™ 4100 series of polishing pad targets processes that require higher hardness pads. It is designed to deliver significantly lower defects in the most advanced Logic and Memory technology nodes.

Benefits:

• Step-out defectivity performance
• Improved balance in trade-offs associated with defectivity and removal rate stability over pad-life
• Easily conditioned pad surface

Applications:

• Shallow trench isolation (STI)/Ceria, interlayer dielectric (ILD), Copper bulk, Tungsten

The Ikonic™ 4200 series of polishing pad targets processes that require higher hardness pads. It is designed for higher removal rate, which can help reduce cost of ownership for customers by giving higher throughput and/or reducing slurry consumption volume.

Benefits:

• Higher removal rate
• Easily conditioned pad surface

Applications:

• STI/Ceria, Tungsten, copper bulk

The Ikonic™ 3000 series of polishing pads targets processes that require medium hardness pads. It is designed to deliver step-out improvements in wafer defect levels and improved topography performance when compared to IC1000™ pads.

Benefits:

• Improved defectivity performance
• Improved topography performance
• Multiple configuration options
• Long pad lifetime
• Easily conditioned pad surface

Applications:

• Copper bulk

The Ikonic™ 2000 series of polishing pads targets processes that require lower hardness pads. It is designed to deliver step-out improvements in wafer defect levels, consistent and stable removal rates, and longer pad lifetime.

Benefits:

• Step-out defectivity performance
• Multiple offerings to meet a range of performance requirements
• Long pad lifetime
• Easily conditioned pad surface

Applications:

• Copper barrier, buff