DuPont™ Interra™ embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board.
It provides very low impedance at high frequency, power bus decoupling, and electromagnetic interference reduction. Interra™ HK 04J saves PWB cost by replacing SMT by-pass capacitors, their PTInterra™ HK 04J Planar Capacitor Laminate
Interra® HK04J embedded capacitance laminate is used between the power and ground planes within a multilayer printed wiring board (PWB).
Interra® HK04J provides very low impedance at high frequency, power bus decoupling, and electromagnetic interference reduction. It replaces surface mount by-pass capacitors and their plated-through-holes, which improves the reliability, design flexibility, packaging size and cost of the PWB.
Interra® HK04J is an all-polyimide dielectric laminate that offers the best mechanical properties, reliability and capacitance stability on the market. It can be processed as a thin flexible circuit laminate through the develop/etch/strip process steps. The HK04J dielectric is flexible and can be imaged and etched to remove copper on both sides of the dielectric at the same time. HK04J provides high reliability through PWB processing and in extreme PWB conditions (eg. the Mars Rover).
Benefits of Embedded Capacitance
Features of Interra® HK04J