Optivision™ CMP Polishing Pads

The Optivision™ pad series for chemical mechanical planarization (CMP) is DuPont’s second generation soft pad that improves on the performance of Politex™ pads and is designed for improvements in cost of ownership.

  • Benefits:

    • Improved removal rate and defectivity compared to Politex™ polishing pads
    • Available on multiple substrates
    • Improved lifetime compared to Politex™ pads

    Applications:

    • Copper barrier, buff, polysilicon
 
 
 
Other CMP Applications

Our CMP pads cover a wide range of applications and technology nodes. To further explore DuPont CMP pads, see our overview of product families by application.