The Optivision™ pad series for chemical mechanical planarization (CMP) is DuPont’s second generation soft pad that improves on the performance of Politex™ pads and is designed for improvements in cost of ownership.

  • Benefits:

    • Improved removal rate and defectivity compared to Politex™ polishing pads
    • Available on multiple substrates
    • Improved lifetime compared to Politex™


    • Copper barrier, Buff, Polysilicon