Optivision™ Pro Polishing Pad Series

Optivision™ Pro Polishing Pad Series

The Optivision™ Pro series of polishing pads for chemical mechanical planarization (CMP) is DuPont’s third-generation soft pad manufactured on a new platform that facilitates advanced polishing and is designed for improvements in cost of ownership.

Applications
  • Copper barrier, buff, polysilicon
 
 
 

Features & benefits

  • Available with windows to enable endpointing options
  • Highest TEOS removal rate and lowest defectivity offering from DuPont
  • Improved lifetime compared to Politex™ and Optivision™ pads
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    Technical Resources
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      Safety Data Sheets(All Languages)
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        Other CMP Applications

        Our CMP pads cover a wide range of applications and technology nodes. To further explore Dupont CMP pads, see our overview of the product families by application

         
         
         
         
         
         
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