Politex™ CMP Polishing Pads

The Politex™ pad series for chemical mechanical planarization (CMP) is used for copper barrier, buffing and cleaning applications. Politex™ pads are the industry-standard soft pad.

  • Benefits:

    • Industry-standard soft pad for multiple applications
    • Requires no conditioning

    Applications:

    • Copper barrier, buff
Other CMP Applications

Our CMP pads cover a wide range of applications and technology nodes. To further explore DuPont CMP pads, see our overview of product families by application.