The Politex™ pad series for chemical mechanical planarization (CMP) is used for Copper barrier, buffing and cleaning applications. Politex™ pads are the industry standard soft pad.
We love to talk about how our electronic solutions can build business, commercialize products and solve the greater challenges of our time.
Subscribe to Ideas & Innovation
Copyright © 2019 DuPont and Dow. All rights reserved. The DuPont Oval Logo and DuPont™ are trademarks of E. I. du Pont de Nemours and Company or its affiliates. The Dow Diamond Logo, Dow™ are trademarks of the Dow Chemical Company or its affiliates.
You're almost done! We just need a little more information below and you'll be on your way to receiving recent Ideas & Innovation articles from DuPont.
DuPont cares about your privacy. Your personal information (name, eMail, phone number and other contact data) will be stored in chosen customer systems primarily hosted in the United States. This information will be used by DuPont, its affiliates, partners, and selected third parties in other countries to provide you with the product or service information requested. To learn more, please visit www.privacy.dupont.com. By providing your personal information, you agree to the terms and conditions of this Privacy Statement.
You will be receiving email of recent Ideas & Innovation articles from DuPont.