Dry Film Photoresist

Riston® Laser Series Dry Film Photoresist

 

Ultra Fast Photospeed Direct Imaging Resist

DuPont began formulating specialized photoresists for Laser Direct Imaging (LDI) over 20 years ago, and continues to lead the industry with its Riston® LaserSeries films.

Ultra fast photospeed, high performance, and compatibility with conventional printed wiring board (PWB) processes are critical to help PWB fabricators optimize their LDI equipment investments.

Riston® Laser Series Dry Film Photoresists Include:

Riston® DI3000 series for T/E and P/E

  • Superior tenting capability – larger than 7mm round holes and 2*10 mm slot holes @38um FT
  • Excellent chemical resistance with no ragged line
  • Wide operation window by fine line capability
  • Capable with i-line & h-line multiple wavelength DI equipment
  • Low sludge/foaming for easy maintenance 

 

 

Riston® DI5100 series for mSAP

  • Excellent fine line adhesion and resolution for 30/30 design 
  • 8um I/L adhesion and 11um L/S resolution @25um FT after developing
  • High productivity with fast photospeed (40 to 60mJ/cm2)
  • Capable with i-line & h-line multiple wavelength DI equipment
  • Minimized footing to ensure sharp and clear plating sidewall without undercut
  • Easy stripping & low sludge/foaming 
  • High acid resistance for advanced subtractive process

 

 

Riston® DI9200 series for Fine line T/E

  • Excellent L/S & I/L resolution for 80um pitch design
  • High productivity with fast photospeed 
  • Superior YieldMaster® technology compatibility
  • Excellent conformation to minimize open/nick defects
  • Capable with i-line & h-line multiple wavelength DI equipment
  • Clean formulation with low sludge and foam
  • Excellent Ferric acid resistance for steel milling

 

DI9225

Performance

Thickness

25um

Photospeed

13~18mj

Resolution(L/S)

19um

Adhesion(I/L)

19um

TTC (sec)

15

 
 
 

 

Riston® DI2000 series for T/E and P/E 

  • Suitable for UV-LASER 355 nm or UV-LED Direct Imaging 
  • Vivid print out image after exposure for easy inspection. 
  • Suitable for both print & etch and pattern plate applications on scrubbed and unscrubbed electroless copper with high acid resistance performance 

 

Riston® LDI8300

  • Suitable for UV-LASER 405nm Direct Imaging. 
  • Good fine-line capability
  • Vivid print out image after exposure for easy inspection
  • Suitable for Print and Etch / Tent and Etch application with acid etching, and print, plate and etch application 
  • Lower sludge & foaming

 

Riston® LDI7300M

  • Suitable for UV-LASER 355nm Direct Imaging
  • Vivid print out image after exposure for easy inspection.
  • Suitable for Print and Etch / Tent and Etch application with acid etching, and Print, Plate and Etch application

 

Riston® LDI7200

  • Designed to provide superior performance on LDI imaged outerlayer boards
  • Broad range of plating solutions (copper, tin, solder, nickel and gold)
  • Available in thicknesses ranging from 40 microns to 100 microns
  • Gives fabricator one film to meet all of their imaging needs

 

Riston® LDI7000

  • Customized for tent and etch processes with 355nm direct imaging equipment
  • Excellent tenting strength, resolution and adhesion
  • Fast stripping that contributes to higher yield and productivity