DuPont's Suba™ pads are chemical mechanical planarization (CMP) pads for stock, intermediate and final polish. They offer significant advantages in achieving consistent, reproducible results in polishing semiconductor wafers, glass and ceramics. The Suba™ family of polishing pad products is the industry standard for silicon stock removal polishing. They may also be used as a sub-pad.
High-removal-rate silicon stock polishing pad
Our CMP pads cover a wide range of applications and technology nodes. To further explore DuPont CMP pads, see our overview of product families by application.