Dry Film Photoresists - WLP Series

High Performance and High Resolution Multi-Purpose Dry Film Photoresist

WLP 1000 Series dry film photoresists are high resolution, multi-purpose films compatible with copper pillar plating and solder bump plating, both lead-free and eutectic. These films are available in 50, 75, 100 and 120 micron thicknesses.

Features:

• High resolution for fine pitch electro plating process
• High chemical resistance for silver plating, ENIG and ENEPIG
• No damage for active metal even through RIE process 
• Na2CO3 and TMAH developable
• Fast and totally dissolved stripping mode

Benefits:

• Capability for finer pitch work than alternative products
• Improved plating performance
• Higher development productivity when using TMAH
• Cleaner stripping

Related Links:

• Our Semiconductor Packaging Portfolio