Improved Solutions that Advance DuPont’s Commitment to Sustainability: PCMPSolv™ Family of Cleaning Products
December 13, 2021
As a global leader in science and chemistry solutions, DuPont takes seriously our responsibility to impact our community and environment in a positive manner. To this end, we’ve put in place a set of corporate-wide goals aimed at enabling a more sustainable future. As part of this effort, we are developing safer-by-design chemistries and material solutions. One example is our new PCMPSolv™ family of cleaner products.
We developed the PCMPSolv™ products to meet advanced post-chemical mechanical planarization (PCMP) cleaning needs. These include copper PCMP back-end-of-line (BEOL) cleans and mid-end-of-line (MEOL) or front-end-of-line (FEOL) applications such as tungsten (W), cobalt (Co), ceria, polysilicon or carbon PCMP cleans.
A critical step in the semiconductor manufacturing process, CMP is used at each layer of the wafer to remove excess materials and create a smooth surface. During the CMP process, a pad and a slurry interact on a polishing tool, which generate residues and other polishing byproducts. PCMP cleaning is required to remove these residues and polishing byproducts to help ensure device reliability and yield requirements while helping to protect exposed metals from corrosion. As the industry moves to smaller devices and adds new materials and interconnecting layers, additional requirements – e.g., atomic surface cleanliness, roughness, and new material compatibilities – are making PCMP cleans increasingly more complex.
When designing the PCMPSolv™ family of cleaners, we focused on integrating safer-by-design and green chemistry principles into the innovation process. In addition to meticulously selecting the raw materials to replace aggressive cleans such as Standard Cleans 1 (SC1) or SPM (Sulfuric Peroxide Mix), we have also chosen to manufacture higher-concentration solutions that offer the same cleaning performance and corrosion control. In addition, these cleaners are provided in a highly concentrated form, enabling lower cost of ownership through higher pre-use dilution capability.
Interested customers should contact their account managers to learn more about the DuPont™ PCMPSolv™ family of cleaners.
Related Information
DuPont’s EKC post-CMP cleaners are aqueous formulations used for post-CMP cleaning designed to protect planarized metals and dielectrics.
Discover DuPont’s range of materials offerings for CMP, including slurries and hard/soft polishing pads for many CMP applications.
Specialty removal and clean chemistries for use in post-chemical mechanical polishing (CMP) and post-etch processes.
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