Electronic Components


Electronic Connectors

Expert Metal Finish Solutions for Electronic Connectors

DuPont offers customers many choices of metal finishes for connectors depending on the demands of each application, including alloys tailored to customer requirements. Our broad portfolio of materials includes:

  • Options for solderless connections
  • Inkjet masking for selective plating of gold contacts
  • Cost-effective alternatives to gold finishes without sacrificing performance
  • A wide variety of cleaners, surface treatments, and strippers to enhance metal finish performance

Choose DuPont as your partner for connector materials that:

  • Improve corrosion resistance
  • Improve connector performance
  • Extend the lifetime of metal surfaces
  • Electronic connectors join circuits together. They come in a wide range of shapes and sizes, from standard formats such as USB to custom products designed for a specific application. Demands on connectors depend on the dimensions and the end-use cases. Connectors may be single insertion—connected once during product assembly and remaining in place for the lifetime of the product—or multi-insertion, where they must maintain electrical conductivity during many insertions.

  • Automotive applications are driving the greatest need for new connector designs and materials. Connectors must operate in harsh environments, exposed to high temperature and corrosive chemicals. The automotive industry requires both single insertion and multi-insertion connectors and is migrating toward solderless press-fit connections.

    Surface finishes play a critical role in connector reliability. Gold is an excellent coating material for connectors because of its high electrical conductivity and resistance to corrosion, but high cost is a drawback.

Electronic Components

  • Connectors
  • Leadframes
  • Passive Devices
  • Tape Automated Bonding


Expert Metal Finish Solutions for Connectors

Ancillaries for Connectors

Pre-and-post treatment products that enhance the performance of Connectors parts

Bright and Matte Tin Electroplating Products for Connectors

A complete family of electrolytic tin technologies to enhance reliable interconnections for connector parts

Gold and Gold Alloy Electroplating Products for Connectors

 Innovative technologies that enable higher productivity, better functionality and stronger sustainable developments

Indiplate™ Indium

Advanced Indium electroplating technologies that enhance the reliability of interconnections for connector parts

Nickel and Nickel Alloy Electroplating Products

Electrolytic nickel plating products for the Connector market that enhance corrosion resistance and inhibit tin whisker growth

Palladium and Palladium Alloy Electroplating Products

Electrolytic palladium and palladium alloy products with functionality, cost efficiency and environmental performance

Silver and Silver Alloy Electroplating Products for Connectors

Innovative cyanide-free electrolytic silver products that reduce or replace gold plating

Solderon™ BHT-350 Bright Tin for Connectors

A high-speed, sulphonate-based tin electroplating product that provides bright deposits over a wide current density range


Tailored metal plating solutions to enhance leadframe performance and component reliability.

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Ancillaries for IC Leadframes

A family of pre-and-post treatment products that enhance the performance of IC leadframes parts

High Speed Silver Electroplating Products for IC Leadframes

High purity electrolytic silver jet plating products for the IC leadframe market

Matte Tin Electroplating Products for IC Leadframes

A complete family of electrolytic tin products that enhance functionality with reduced cost of ownership

Nickel, Palladium, and Gold Electroplating Products for IC Leadframes

Advanced electrolytic nickel, palladium and gold products for pre-plated frames application

Silverjet™ High Brightness Silver

A high brightness silver electrolytic finish for leadframes that enable high performance LED packages

Solderon™ ST-300T Matte Tin

Enabling high-throughput for maximum cost benefit while delivering exceptional performance

Surface Treatment for IC Leadframes

Advanced surface treatment material that reduce silver immersion, minimize epoxy bleed, and inhibit tin whisker growth

Passive Devices

Ensuring Reliable Connections for All Passive Devices

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Copper Electroplating Products for Passive Devices

A range of electrolytic copper plating products designed for plating of passive devices

Nickel Electroplating Products for Passive Devices

Advanced electrolytic nickel plating products for Passive Devices that enhance corrosion resistance

Tin and Tin-Alloy Electroplating Products for Passive Devices

Leading electrolytic tin products that meet the needs of passive devices

Tape Automated Bonding

Immersion tin for TAB and COF manufacturing.

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Ancillaries for TAB/COF

Supporting products for pre-and-post treatment to enhance the performance of the TAB/COF products

Immersion Tin Products for TAB/COF

Immersion tin products providing exceptional performance with low running cost