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Process Solutions for Passive Components
Ensuring Reliable Connections for All Passive Components
DuPont provides electronic-grade electrolytic nickel, matte tin, and electrolytic copper plating products that provide stable deposit compositions, with exceptional thermal resistance, adhesion and solderability. Our post-treatment materials ensure that metal plating will remain functional throughout device storage and manufacturing.
Choose DuPont as your materials solutions partner to:
- Meet demanding surface finish reliability requirements
- Enhance the assembly yield of the smallest passive devices
- Work with you to provide a complete solution
Electronic Components
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Passive Components
Passive Components
Ensuring Reliable Connections for All Passive Devices
VIEW DETAILSA range of electrolytic copper plating products designed for plating of passive componentsAdvanced electrolytic nickel plating products for Passive Components that enhance corrosion resistanceLeading electrolytic tin products that meet the needs of passive components -
Leadframes
Leadframes
Sustainable total process solutions for high reliability and enhanced process efficiency
VIEW DETAILSA family of pre-and-post treatment products that enhance the performance of IC leadframes partsA complete family of electrolytic tin products that enhance functionality with reduced cost of ownershipAdvanced electrolytic nickel, palladium and gold products for pre-plated frames applicationHigh purity electrolytic silver jet plating products for the IC leadframe marketA high brightness silver electrolytic finish for leadframes that enable high performance LED packagesAdvanced surface treatment material that reduce silver immersion, minimize epoxy bleed, and inhibit tin whisker growth -
Connectors
Connectors
Process solutions for Electronic Connector Finishing
VIEW DETAILSPre-and-post treatment products that enhance the performance of Connectors partsA complete family of electrolytic tin technologies to enhance reliable interconnections for connector partsInnovative technologies that enable higher productivity, better functionality and stronger sustainable developmentsAdvanced Indium electroplating technologies that enhance the reliability of interconnections for connector partsElectrolytic nickel plating products for the Connector market that enhance corrosion resistance and inhibit tin whisker growthElectrolytic palladium and palladium alloy products with functionality, cost efficiency and environmental performanceInnovative cyanide-free electrolytic silver products that reduce or replace gold plating -
Tape Automated Bonding
Tape Automated Bonding
Immersion tin for TAB and COF manufacturing.
VIEW DETAILSSupporting products for pre and post treatment to enhance the performance of the TAB/COF products.Leading immersion tin products providing exceptional performance with low running cost.