DuPont provides electronic-grade electrolytic nickel, matte tin, and electrolytic copper plating products that provide stable deposit compositions, with exceptional thermal resistance, adhesion and solderability. Our post-treatment materials ensure that metal plating will remain functional throughout device storage and manufacturing.
Choose DuPont as your materials solutions partner to:
Ensuring Reliable Connections for All Passive Devices
VIEW DETAILSSustainable total process solutions for high reliability and enhanced process efficiency
VIEW DETAILSProcess solutions for Electronic Connector Finishing
VIEW DETAILSImmersion tin for TAB and COF manufacturing.
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