DuPont provides electronic-grade electrolytic nickel, matte tin, and electrolytic copper plating products that provide stable deposit compositions, with exceptional thermal resistance, adhesion and solderability. Our post-treatment materials ensure that metal plating will remain functional throughout device storage and manufacturing.
Choose DuPont as your materials solutions partner to:
Ensuring Reliable Connections for All Passive DevicesVIEW DETAILS
Sustainable total process solutions for high reliability and enhanced process efficiencyVIEW DETAILS
Process solutions for Electronic Connector FinishingVIEW DETAILS
Immersion tin for TAB and COF manufacturing.VIEW DETAILS