DuPont is expanding its offering of integrated solutions for both current and emerging WLP requirements in the semiconductor industry.
WLP solutions for three dimensional and through silicon vias (3D/TSV), bonding, fan out, bumping, pillars and redistribution dielectrics are tested and proven for area array package requirements, whether stencil printed, plated, pillared or C4 applied.
Key benefits of these integrated solutions include higher yields, increased reliability and lower cost of ownership.
Explore our product offerings:
WBR and WB series films for wafer bumping deliver excellent performance in both photo stencil and electroplating processes, and are available in a range of 50-120 microns thicknesses.
Our WLP 1000 Series dry film photoresists are high resolution, multi-purpose films compatible with copper pillar plating and solder bump plating, both lead-free and eutectic. These films are available in 50, 75, 100 and 120 micron thicknesses.
DuPont MX Series dry film photoresists excel in etching and electroplating processes. These films are designed for RDL, TSV, lift-off, and MEMs applications, and are available in a range of 10-50 micron thicknesses.
Wafer-level packaging dry-film photoresist solutions for 3DIC, fan out, bumping, copper pillar and redistribution applications.
Multi-purpose dry film photoresists designed for redistribution layer, copper TSV, lift-off, and MEMs applications.
High-resolution dry film photoresists for wafer bumping applications in advanced semiconductor packaging
High-performance and high-resolution multi-purpose dry film photoresist for semiconductor packaging compatible with copper and solder plating chemistries.