Ordinary die attach adhesives suit ordinary chip applications. But when a chip design must deliver reliable performance in extreme temperatures, high moisture or toxic environments, look to Dow for extraordinary solutions.
Our industry-leading portfolio of silicone die attach adhesives delivers proven, dependable bonds for the most demanding chip applications in automotive, communications, consumer electronics and industrial markets. Well-suited to address fine-pitch circuit patterns or the extreme heat of lead-free reflow processes, all of our advanced products enhance the reliability of your electronics by offering:
Our broad selection of die attach solutions offers versatile options for superior chip designs. Select formulations target volume resistivity as high as 10-4 ohm-cm, or electrical insulation from 1013 to 1015 ohm-cm, or thermal conductivity up to 6.8 W/mk. These materials are designed to perform reliably at temperatures above 260°C, and ensure strong, flexible bonds - even between materials with different coefficients of thermal expansion.
DOW CORNING™ die attach adhesives are solventless, environmentally responsible products that cure at a range of temperatures - further reducing thermal stress and energy consumption. All materials in this product family are one-part silicones and can be processed using standard microelectronics equipment.