DuPont Electronics & Industrial’s high-performing silicone die encapsulants help protect high-value microelectronics in demanding automotive, communications, and consumer electronics applications.
Formulated to tailor rheology for ease of application and low ionic impurities, these materials are designed to protect sensitive semiconductor devices with void-free application around complex packaging designs. They are compatible with commonly-used dispensing and screen printing techniques.
As electronics are used in increasingly harsh environments, it’s more critical than ever to protect sensitive devices or components against thermal and mechanical stress.
DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. Click here to view a short video of our comprehensive offerings.
Our silicone die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free solder processing or stringent thermal stress-reliability testing conditions.
DuPont’s portfolio of silicone-based lid-seal adhesives are designed to handle the high functionality of today’s advanced packaging processes, delivering the performance needed for today’s high-performance computing, mobile and automotive electronic applications.
Ordinary die-attach adhesives suit ordinary chip applications. But when a chip design must deliver reliable performance in extreme temperatures, high moisture, or stressful environments look to DuPont Electronics & Imaging for extraordinary solutions.
Our thermally conductive silicones are designed to handle the heat dissipation of today’s advanced electronic devices.
Photo-patternable dielectrics and non-photo-patternable adhesives make possible chip-to-wafer and wafer-to-wafer stacking for heterogeneous integration.
We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.