Die Encapsulants


Protecting High-Value Microelectronics

DuPont Electronics & Industrial’s high-performing silicone die encapsulants help protect high-value microelectronics in demanding automotive, communications, and consumer electronics applications.

Formulated to tailor rheology for ease of application and low ionic impurities, these materials are designed to protect sensitive semiconductor devices with void-free application around complex packaging designs. They are compatible with commonly-used dispensing and screen printing techniques.

They feature:

  • Low ionic content
  • Low moisture
  • Minimal shrinkage during processing
  • Low modulus for mechanical stress protection
  • Compatible with commonly-used dispensing and screen printing technique
  • As electronics are used in increasingly harsh environments, it’s more critical than ever to protect sensitive devices or components against thermal and mechanical stress.


Semiconductor Assembly Materials

  • Die Encapsulants

    Our silicone die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free solder processing or stringent thermal stress-reliability testing conditions.

  • Lid Seal Adhesives

    DuPont’s portfolio of silicone-based lid-seal adhesives are designed to handle the high functionality of today’s advanced packaging processes, delivering the performance needed for today’s high-performance computing, mobile and automotive electronic applications.

  • Die Attach Adhesives

    Ordinary die-attach adhesives suit ordinary chip applications. But when a chip design must deliver reliable performance in extreme temperatures, high moisture, or stressful environments look to DuPont Electronics & Industrial for extraordinary solutions.

  • Thermal Interface Materials

    Our thermally conductive silicones are designed to handle the heat dissipation of today’s advanced electronic devices.

  • Permanent Bonding Dielectrics

    Photo-patternable dielectrics and non-photo-patternable adhesives make possible chip-to-wafer and wafer-to-wafer stacking for heterogeneous integration.


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