DuPont offers a family of epoxy-based adhesive solutions offering superior peel strength, chemical, and heat resistance.
Epoxy materials may provide a cost-effective alternative for many base-level designs not requiring multiple high-temperature lamination cycles.
Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.VIEW DETAILS
DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.VIEW DETAILS
Superior bond strength and flexibility for high volume applicationsVIEW DETAILS
DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.VIEW DETAILS
Interra® thin copper clad laminates for embedded capacitance.VIEW DETAILS