Laminates

Epoxy Adhesive Solutions

Epoxy Adhesive Solutions

DuPont offers a family of epoxy-based adhesive solutions offering superior peel strength, chemical, and heat resistance.

Epoxy materials may provide a cost-effective alternative for many base-level designs not requiring multiple high-temperature lamination cycles.

Epoxy-based Adhesive Solutions include:

Pyralux® HXC black flexible circuit material - DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. 

DuPont offers additional Epoxy-based Adhesive Solutions under the Nikaflex® Brand.

Laminate Product Selector

Find the best product for your application.

Laminate Materials For PCBs

  • Epoxy Adhesive Solutions
  • All-Polyimide Solutions
  • Acrylic-based Adhesive Solutions
  • Fluoropolymer Adhesive Solutions
  • Thin Copper Clad Laminate

Epoxy Adhesive Solutions

Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.

Pyralux® HXC

DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.


All-Polyimide Solutions

DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.

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Pyralux® APR

DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.

Pyralux® AC

DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.

Pyralux® AP

DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.

Pyralux® HT

Pyralux® HT is an all polyimide flexible laminate system with the highest service temperature available today, that includes a double-sided copper-clad laminate and a unique all polyimide coverfilm or bonding material.


Acrylic-based Adhesive Solutions

Superior bond strength and flexibility for high volume applications

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Pyralux® FR

DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.

Pyralux® LF

DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.

Pyralux® LF-B

DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired.


Fluoropolymer Adhesive Solutions

DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.

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Pyralux® TK

DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.


Thin Copper Clad Laminate

Innovative thin copper clad laminates push electrical boundaries

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Interra™ HK04J

DuPont™ Interra™ embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board.