Epoxy Adhesive Solutions

Pyralux® GPL Sheet Adhesive is a proprietary B-staged modified epoxy adhesive and is primarily utilized to bond flexible inner layers or rigid cap layers in flexible and rigid-flex constructions..

DuPont™ Pyralux® HXI is DuPont™ Kapton® black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It offers thinner construction than Pyralux® HXC, but similar mechanical and process properties.

DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.

DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.

DuPont™ Pyralux® AG is an all-polyimide double sided copper clad laminate that is offered in both sheets and rolls with global availability and is ideal for use in high volume consumer, medical and automotive applications.

DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.

Pyralux® HT is an all polyimide bonding film with the highest service temperature available today and low loss performance when paired with Pyralux® AP.

DuPont™ Pyralux® TA series are all polyimide copper clad laminates designed for high speed high frequency applications. Paired offerings of double sided and single sided clads enable multi-layer construction of antenna and feedlines with good material compatibility.

DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.

DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.

DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired.

DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.

Interra® HK04M is DuPont’s next generation embedded capacitance laminate, which has been optimized to handle thinner dielectric layers and further reduce the impedance between power and ground planes in a printed wiring board.