DuPont offers a family of epoxy-based adhesive solutions offering superior peel strength, chemical, and heat resistance.
Epoxy materials may provide a cost-effective alternative for many base-level designs not requiring multiple high-temperature lamination cycles.
Find the best product for your application.
Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.
DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.
DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.
DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.
DuPont™ Pyralux® AG is an all-polyimide double sided copper clad laminate that is offered in both sheets and rolls with global availability and is ideal for use in high volume consumer, medical and automotive applications.
DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.
Pyralux® HT is an all polyimide bonding film with the highest service temperature available today and low loss performance when paired with Pyralux® AP.
DuPont™ Pyralux® TA series are all polyimide copper clad laminates designed for high speed high frequency applications. Paired offerings of double sided and single sided clads enable multi-layer construction of antenna and feedlines with good material compatibility.
Superior bond strength and flexibility for high volume applications
DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.
Interra® thin copper clad laminates for embedded capacitance.
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and solve the challenges of our time.