DuPont offers a complete line of acrylic-based adhesive systems that offer superior bond strength and flexibility in high volume applications.
Many standard and customized constructions of core dielectric, adhesive, and copper thicknesses are available to meet today's demanding design requirements requiring multiple high-temperature lamination cycles.
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Superior bond strength and flexibility for high volume applications
DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.
Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.
DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.
Interra® thin copper clad laminates for embedded capacitance.