Acrylic-based Adhesive Solutions


Pyralux® Acrylic-based Adhesive Solutions

DuPont offers a complete line of acrylic-based adhesive systems that offer superior bond strength and flexibility in high volume applications.

Many standard and customized constructions of core dielectric, adhesive, and copper thicknesses are available to meet today's demanding design requirements requiring multiple high-temperature lamination cycles.


Laminate Product Selector

Find the best product for your application.


Laminate Materials For PCBs

  • Acrylic-based Adhesive Solutions

    Superior bond strength and flexibility for high volume applications

    DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.

    DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.

    DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired.
  • All-Polyimide Solutions

    DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.

    DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.

    DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.

    DuPont™ Pyralux® AG is an all-polyimide double sided copper clad laminate that is offered in both sheets and rolls with global availability and is ideal for use in high volume consumer, medical and automotive applications.

    DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.

    Pyralux® HT is an all polyimide bonding film with the highest service temperature available today and low loss performance when paired with Pyralux® AP.

    DuPont™ Pyralux® TA series are all polyimide copper clad laminates designed for high speed high frequency applications. Paired offerings of double sided and single sided clads enable multi-layer construction of antenna and feedlines with good material compatibility

  • Epoxy Adhesive Solutions

    Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.

    Pyralux® GPL Sheet Adhesive is a proprietary B-staged modified epoxy adhesive and is primarily utilized to bond flexible inner layers or rigid cap layers in flexible and rigid-flex constructions..

    DuPont™ Pyralux® HXI is DuPont™ Kapton® black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It offers thinner construction than Pyralux® HXC, but similar mechanical and process properties.

    DuPont™ Pyralux® HP is an epoxy-based adhesive system demonstrating both low loss and high reliability, specifically designed for OEMs and PCB design manufacturers. Its optimized low-loss solution is suitable for multi-layer flex and rigid-flex designs for military, automotive and medical industries. Pyralux® HP adhesive provides best-in-class insertion loss performance, increased functionality and ease of processing while maintaining high reliability. 

    DuPont™ Pyralux® HXC Black Coverlay features DuPont™ Kapton® MBC, matte black polyimide film, for high performance applications where design aesthetics are critical. This product is coated on one side with a proprietary B-staged modified epoxy adhesive. Pyralux® HXC Coverlay can be used to encapsulate etched details in flexible and rigid-flex multilayer constructions for environmental protection and electrical insulation. Black coverlay is also commonly used to enhance circuit aesthetics and improve LED lighting controls in specialty applications
  • Fluoropolymer Adhesive Solutions

    DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.

    DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.
  • Thin Copper Clad Laminate

    Interra® thin copper clad laminates for embedded capacitance.

    DuPont™ Interra® embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board.

    Interra® HK04M is DuPont’s next generation embedded capacitance laminate, which has been optimized to handle thinner dielectric layers and further reduce the impedance between power and ground planes in a printed wiring board.

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