DuPont™ Interra® thin copper clad laminates are specifically designed for use as embedded capacitance materials in multilayer rigid printed circuit boards. They offer the best mechanical strength, reliability and capacitance stability on the market.
By utilizing Interra® laminates between the power and ground planes in a Power Distribution Network (PDN), designers can reduce the modal resonances and lower the inductance between the power and ground planes. This has the effect of reducing the impedance in the system and decreasing the number of required surface mount capacitors.
All Interra® thin copper clad laminates utilize low-profile electrodeposited (ED) copper laminated to thin polyimide based dielectric. This dielectric is engineered to have superior adhesion to copper than traditional glass-reinforced materials utilized in rigid boards. The polyimide dielectric is based on DuPont™ Kapton® technology, but is specifically engineered to have low dielectric loss, high dielectric isolation and strength, and tight thickness tolerance.
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Interra® thin copper clad laminates for embedded capacitance.
DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.
DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.
DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.
DuPont™ Pyralux® AG is an all-polyimide double sided copper clad laminate that is offered in both sheets and rolls with global availability and is ideal for use in high volume consumer, medical and automotive applications.
DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.
Pyralux® HT is an all polyimide bonding film with the highest service temperature available today and low loss performance when paired with Pyralux® AP.
DuPont™ Pyralux® TA series are all polyimide copper clad laminates designed for high speed high frequency applications. Paired offerings of double sided and single sided clads enable multi-layer construction of antenna and feedlines with good material compatibility.
Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.
DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.
Superior bond strength and flexibility for high volume applications
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