DuPont™ Interra® thin copper clad laminates are specifically designed for use as embedded capacitance materials in multilayer rigid printed circuit boards. They offer the best mechanical strength, reliability and capacitance stability on the market.
By utilizing Interra® laminates between the power and ground planes in a Power Distribution Network (PDN), designers can reduce the modal resonances and lower the inductance between the power and ground planes. This has the effect of reducing the impedance in the system and decreasing the number of required surface mount capacitors.
All Interra® thin copper clad laminates utilize low-profile electrodeposited (ED) copper laminated to thin polyimide based dielectric. This dielectric is engineered to have superior adhesion to copper than traditional glass-reinforced materials utilized in rigid boards. The polyimide dielectric is based on DuPont™ Kapton® technology, but is specifically engineered to have low dielectric loss, high dielectric isolation and strength, and tight thickness tolerance.
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Interra® thin copper clad laminates for embedded capacitance.
DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.
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Superior bond strength and flexibility for high volume applications