With the higher functionality of flip chip packaging comes higher processing and operating temperatures that can damage your sensitive electronic products.
Dow’s portfolio of silicone lid seal adhesives can help manage heat to promote more reliable, long-term performance. Our products and expertise advanced packaging for early flip chips and larger die sizes, and we continue to help drive broader adoption of these cutting-edge technologies today.
Our high-purity lid seal adhesives meet the demanding criteria of IC packaging, targeting computer, handheld electronics and automotive applications. Offering excellent primerless adhesion to a wide variety of substrate materials and components, they perform reliably at temperatures in excess of 260°C. That means they can withstand the high processing temperatures associated with lead-free BGA attach and moisture sensitivity level testing applications.
Available in a variety of product forms, Dow’s family of lid seal adhesives comes in thermally conductive and thermally insulating grades to meet a wide range of customer needs.